When you’re building a quick prototype or a one-off project it’s nice to be able to securely mount the various modules and development boards. Sometimes these boards have mounting holes, but often ...

Offered in low-profile and very-low-profile SMT and press-fit aerodynamic options, the DDR3 socket maximizes air flow around memory modules during operation. Engineered with a 2.40mm seating plane, ...

Molex Incorporated has introduced a portfolio of aerodynamic DDR3 DIMM sockets and ultra-low profile DDR3 DIMM memory module sockets, both of which are ideal for demanding memory applications in ...

Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...