As system-on-chip (SoC) complexity grows, so does the necessity for products that seamlessly connect IP and streamline integration processes, minimize manual errors, and enhance productivity. The ...
In a new review article publication from Opto-Electronic Advances, Yingtao Hu, Di Liang and, Raymond G. Beausoleil from Hewlett Packard Labs discuss advanced III-V-on-silicon photonic integration.
Major products rely on advanced packaging to reach the market; a groundswell of die-integration technologies are revolutionizing packaging, assembly, and test. At this exciting time in the industry, ...
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