Earnings Call Insights: Onto Innovation Inc. (NYSE:ONTO) Q4 2024 CEO Michael Plisinski highlighted a record quarterly revenue ...

TL;DR: TSMC plans to increase prices for its 5nm and 3nm process nodes by 5-10% and CoWoS advanced packaging by 15-20% due to high AI demand. These price hikes are expected in January 2025. The 3nm ...

Higgins provided guidance for the December quarter, stating, "Total revenue is expected to be $3.225 billion, plus or minus $150 million." Foundry/logic revenue is forecasted to be about 59% and ...

In a new report from Ctee, Apple has the first production capacity out of TSMC in 2025 for its new 2nm process node, with plans to use next-generation 3D advanced packaging platform SoIC (or System on ...

KLA Corporation KLAC is scaling its advanced packaging business as demand rises for High-Bandwidth Memory (HBM) and advanced logic nodes to support AI workloads. KLAC’s inspection and metrology tools ...

Xtend MA/MH packaging preserves freshness and appearance of tropical fruits during long ocean transport to global markets ...

As chips evolve toward stacked, heterogeneous assemblies and adopt more complex materials, engineers are grappling with new and often less predictable sources of variation. This is redefining what it ...

SK Hynix will invest 19 trillion Korean won to build an advanced packaging fab in Cheongju, North Chungcheong Province. On ...

Driven by the growing demands of artificial intelligence (AI) and hyperscalers, advanced process technologies are accelerating innovation cycles. The supply chain indicates that in 2025, the advanced ...

A new technical paper titled “Thermal stability enhancement of low temperature Cu-Cu bonding using metal passivation ...