Anker THUS chip breaks computing rules to put big AI models on wearable devices

Anker thinks it's solved the riddle of how to get large models on tiny wearable devices, without eating all the battery power ...
Semiconductor Engineering

Power Delivery Challenges in 3D HI CIM Architectures for AI Accelerators (Georgia Tech)

A new technical paper titled “Co-Optimization of Power Delivery Network Design for 3D Heterogeneous Integration of RRAM-based Compute In-Memory Accelerators” was published by researchers at Georgia ...