STMicroelectronics has expanded its Teseo module family with the introduction of the Teseo-VIC3DA. The automotive-qualified navigation module combines ST’s automotive Teseo III GNSS IC with an ...
Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Nisshinbo Micro Devices Inc. has deployed multiple Cadence ® solutions, including the AI-based ...
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