A new technical paper titled “Advancing Trustworthiness in System-in-Package: A Novel Root-of-Trust Hardware Security Module for Heterogeneous Integration” was published by researchers at University ...

Artificial intelligence chip startup DreamBig Semiconductor Inc. said today it has closed on a $75 million equity round of funding, bringing its total amount raised to more than $93 million, according ...

Forbes contributors publish independent expert analyses and insights. Marco Chiappetta is a technologist who covers semiconductors and AI. The semiconductor industry has undergone a major ...

Forbes contributors publish independent expert analyses and insights. Samsung had an industry Foundry event focused on solutions for “Empowering the AI Revolution,” where they announced new process ...

Eliyan has raised $60 million in funding for its chiplet interconnect technology that speeds up the processing for AI chips. Samsung Catalyst Fund and Tiger Global Management both led the round to ...

A new technical paper titled “Garblet: Multi-party Computation for Protecting Chiplet-based Systems” was published by Worcester Polytechnic Institute. “The introduction of shared computation ...

Intel’s optical compute interconnect chiplet is expected to revolutionize high-speed data processing for AI infrastructure. SANTA CLARA, Calif.--(BUSINESS WIRE)--What’s New: Intel Corporation has ...

The semiconductor industry is moving out of the monolithic age of the system-on-chip (SoC). Instead of arranging every building block of IP on the same slab of silicon, the movers and shakers in the ...

Once a niche solution for maximizing silicon yields, chiplets have become the industry’s go-to strategy for delivering more cores at lower costs. AMD popularized the approach with Ryzen and EPYC, ...

There’s currently a significant buzz within the semiconductor industry around chiplets, bare silicon dies intended to be combined with others into a single packaged device. Companies are beginning to ...

Introduces support for the latest interconnect standards, including Universal Chiplet Interconnect Express™ (UCIe™) 2.0 and Open Compute Project Bunch of Wires (BoW). Enhances Keysight’s EDA standards ...