Integration of JUMPtec modules creates the world’s most comprehensive portfolio of application-ready COM platforms SAN ...
Wide range of congatec modules support for computationally powerful, energy-efficient embedded AI applications SAN ...
HFM FPGA Module Standard arrives with solderable and connector variants, aiming to cut board redesign time and vendor lock-in ...
The SGET announced a paradigm shift in embedded design with the official release of the Open Harmonised FPGA Module (oHFM) ...
The PCI Industrial Computer Manufacturers Group (PICMG) has rolled out the COM (computer on module) Express Specification, known as COM.0, an open standard for small-form-factor add-on modules in ...
Eching, Germany, July 8, 2008 – Kontron’s ETX 3.0 conforming ETX-CN8 Computer-on-Modules with the VIA C7 (1.5 GHz) or VIA Eden processors (500 MHz) are now available with the Windows Vista-ready VIA ...
Global computer on module market is poised for substantial growth over the forecast period of 2023-2030, with revenue estimated to rise from US$ 1,338.7 million in 2022 to US$ 2,147.5 million by 2030, ...
The microETXexpress-SP Computer-on-Module employs an Intel Atom processor and offers full COM Express Pinout Type 2 compliance including SDVO graphics. Extending the COM Express specification to ...
What TI's AMP62P Sitara SoC brings to Toradex's Verdin AM62P computer-on-module. A look at the family of Verdin COM family. Toradex's carrier boards for industrial apps. The Verdin COM family supports ...
The new Kontron ETXexpress-AI COM Express computer-on-module offers OEMs a new level of design flexibility thanks to its 32nm Intel Core i7 / Core i5 processor technology, high energy efficiency, wide ...
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