Schematic illustration of an edge computing system based on monolithic 3D-integrated, 2D material-based electronics. The system stacks different functional layers, including AI computing layers, ...
Researchers from Washington University in St. Louis, MIT, Yonsei University, Inha University, Georgia Institute of Technology, and the University of Notre Dame demonstrated monolithic 3D integration ...
(Nanowerk News) Multifunctional computer chips have evolved to do more with integrated sensors, processors, memory and other specialized components. However, as chips have expanded, the time required ...
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