Westlake Village, Calif. — Diodes Inc. a leading manufacturer and supplier of high quality discrete semiconductors, today announced the introduction of the first in a series of planned ultra-miniature ...

The "Power Discrete Packaging Comparison 2018 Complete Teardown Report" report has been added to ResearchAndMarkets.com's offering. The most recent market forecast by the publisher shows the global ...

A technical paper titled “Substrate Embedded Power Electronics Packaging for Silicon Carbide MOSFETs” was published by researchers at University of Cambridge, University of Warwick, Chongqing ...

Microprocessors for PCs are at the forefront of the computing industry, leading with huge nanoscale chips built in multibillion-dollar fab plants. So far, the success of the semiconductor industry has ...

The first annual Automation Conference, bringing together process, discrete and packaging professionals in one conference, kicked off this morning with keynotes speakers from Boeing and ExxonMobil.

Samsung Electronics is exploring the development of discrete package low-power DRAM (LPDDR) for Apple's iPhones to meet the tech giant's evolving requirements, though Samsung has not confirmed these ...