The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...
System-in-package (SiP) is quickly emerging as the package option of choice for a growing number of applications and markets, setting off a frenzy of activity around new materials, methodologies, and ...
High-bandwidth, low-latency connectivity is a must-have in modern data centers. The only challenge? As more CPUs, GPUs, AI accelerators, and memory chips are piled into the data center, they’re being ...
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