Solder joint faults can be described with a single word – pernicious. Solder joints connect the BGA package, containing an FPGA (Field Programmable Gate Array) core, to the PCB (Printed Circuit Board) ...

In previous columns, I explored the shortcomings of today's FPGAs and ICs in terms of package characteristics; the system design problems they are causing; the impact of poorly written application ...

What if manufacturing companies could pinpoint the exact cause of a defect the moment it occurs, preventing costly production delays and ensuring top-notch quality? Generative artificial intelligence ...

The student projects that come out of [Bruce Land]’s microcontroller- and FPGA-programming classes feature here a lot, simple because some of them are amazing, but also because each project is a ...

Metrology is the science of measuring, characterizing, and analyzing materials. Within metrology, there are several technologies used to detect material defects on a very small scale – precision on ...

Detecting sub-5nm defects creates huge challenges for chipmakers, challenges that have a direct impact on yield, reliability, and profitability. In addition to being smaller and harder to detect, ...