AUSTIN, Texas — LSI Logic Corp. said it is production-ready with flip-chip packages on an 0.11-micron process that includes low-k dielectrics. The soft, porous nature of low-k materials presents a ...
MILPITAS, Calif. — LSI Logic Corp. today announced it has licensed its organic laminate flip-chip ball-grid array (FPBGA) packaging technology to Siliconware Precision Industries Ltd., a contract ...
Thermal interface materials (TIMs) have been widely adopted for improved thermal dissipation in flip chip ball grid array (FCBGA), flip chip lidded ball grid array (FCLGA) and flip chip pin grid array ...
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