MELVILLE, N.Y., Feb. 23, 2024 /PRNewswire/ -- Micross Components, Inc. ("Micross"), a leading global provider of mission-critical microelectronic components and services for high-reliability aerospace ...

The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to expand ...

Corpus Christi, Texas – TT Electronics' IRC Advanced Film Division has tucked a series of surface-mount resistor networks in ball-grid array packages. These high-density networks, designated the CHC ...

Over 81% of new digital designs utilize Field Programmable Gate Arrays (FPGAs). With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is ...

Featuring power ratings from 0.5W (0865 ball grid package) to 1.6W (1065 ball grid package), the CHC series of termination arrays are suited for use in portable products and high-speed switches that ...

Simple and inexpensive semiconductor devices in earlier generations of electronic systems were easily discarded or recycled when they were damaged either before or during the printed circuit board ...