Dimensions Consulting has announced a new surface-mount BGA test socket for use with high-speed Serdes applications operating beyond 10 Gbps. In addition, the company announced a test socket for CSP ...

As microprocessors and memory ICs get faster, socket manufacturers face the task of developing production and testing sockets that match the demands posed by these speedy ICs. This is prompting socket ...

For leading-edge devices such as RF ICs, increasing frequency, package density, and thermal issues offer significant challenges to designing effective socket and load-board solutions for test.

As semiconductor devices continue to advance, the demand for reliable, high-performance test sockets has never been greater. Yet, traditional socket design validation methods—such as per-pin ...

Playing a crucial interconnect role in integrated circuits and semiconductor testing, test sockets, aka package probes, serve the role of connecting a device and its tester. IC sockets are categorized ...

Advanced AI/CPU processors demand extreme high frequency and power performance from SLT and ATE test sockets. These sockets are in the critical path at the end of a very costly silicon fabrication and ...

BANGALORE, India, July 11, 2024 /PRNewswire/ -- Semiconductor Test Socket Market is Segmented by Type (Burn-in Socket, Test Socket), by Application (IC Design Company, Packaging Company, IDM, ...