The floodgates for chiplet-based design have officially opened. Over the past several quarters, manufacturing test flows have been validating 2.5D package architectures, and production volumes are ...
Heterogeneous integration is driving innovation in the semiconductor industry, but it also introduces more complexity in chip design, which translates to more intricate test requirements. The ...
LinQuest Corp., Los Angeles, California, has been awarded a $76,637,171 cost-plus-fixed-fee modification (P00014) to contract FA8808-19-C-0006 for system engineering, integration and test support for ...
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