Nasdaq

II-VI Incorporated Introduces Laser Lapping System for Diamond and Superhard Materials Processing

PITTSBURGH, Aug. 20, 2020 (GLOBE NEWSWIRE) -- II‐VI Incorporated (Nasdaq: IIVI), a leading provider of laser technologies for materials processing, today announced the introduction of its L45 laser ...
AZOM

Optimize Wafer Lapping Using MTI’s Real-Time Monitoring Tech

The lapping process involves thinning wafers from the back with a rotating abrasive surface. It is important to receive precise feedback as the process is carried out to monitor the quantity of ...
American Machinist

Cutting Tool Applications, Chapter 18: Lapping and Honing

Lapping is a final abrasive finishing operation that produces extreme dimensional accuracy, corrects minor imperfections of shape, refines surface finish and produces close fit between mating surfaces ...
Nasdaq

II-VI Incorporated Adds Profile-Shaping Laser to Its Lineup of High-Precision Surface-Lapping Laser Tools for Diamond and Superhard Materials Processing

PITTSBURGH, March 16, 2022 (GLOBE NEWSWIRE) -- II‐VI Incorporated (Nasdaq: IIVI), a leading provider of laser technologies for materials processing, today announced the introduction of its advanced ...
Hosted on MSN

Optimize Wafer Lapping Using MTI’s Real-Time Monitoring Tech

Sponsored by Vitrek, LLCReviewed by Maria OsipovaOct 9 2025 The wafer lapping process is key to effective semiconductor thinning. It requires extremely tight control to avoid over-removal of material ...