Some of the world's most advanced research in micro- and nanoelectronic-packaging reliability is taking place in the Electronic Packaging Laboratory in the UB School of Engineering and Applied ...

Achieving the circuit densities we need for the next generation of electronics demands advanced packaging and chip-scale interconnect solutions. The need to look for alternative packaging solutions to ...

Electronic Vehicles (EVs) have been at the center of attention in recent years. With the automotive industry becoming more aligned with sustainable development goals, the focus has shifted toward EVs ...