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SK Hynix's $13B packaging facility promises more HBM for the AI bubble
Great news for AMD and Nvidia, less so for cash-strapped consumers Memory makers just can't churn out their DRAM fast enough.
Reports out of Taiwan indicate that memory packaging and testing services are getting more expensive, with several suppliers ...
China's domestic memory module maker Biwin Storage Technology has released the A-share market's first major 2025 profit ...
The memory packaging market was valued at USD 21.53 billion in 2018, and is expected to reach USD 29.41 billion by 2024, registering a CAGR of 5.5% during the forecast period of 2019 - 2024. Memory ...
Memory packaging revenues are estimated by Yole Developpement to be worth $31.8 billion in 2028 with a CAGR22-28 of 13%. DRAM will grow with a CAGR22-28 of around 13%, reaching around $20.7 billion in ...
Penguin Solutions, Inc. announced that its SMART Modular CXL NV-CMM E3.S 2T non-volatile memory module has successfully ...
DRAM devices handle data transfer to and from the CPU in computer systems. DRAM modules are used in many applications from desktop PC motherboards to notebooks, servers and PDAs. As the demand ...
Increasingly, memory chips—in combinations of all their flavors, including DRAM, SRAM, and flash—are at the forefront of microelectronics end-product functions. This scenario is true for cell-phone ...
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