Micron has now entered the HBM3 race by introducing a “second-generation” HBM3 DRAM memory stack, fabricated with the company’s 1β semiconductor memory process technology, which the company announced ...

Researchers in Japan have developed ultrathin ferroelectric capacitors that maintain strong polarization at a stack thickness ...

Artificial intelligence has raced ahead so quickly that the bottleneck is no longer how many operations a chip can perform, ...

Samsung, SK hynix, and Micron are fighting each other over new 16-Hi HBM memory, as NVIDIA requests the new 16-Hi HBM memory ...

SK hynix has completed development of its HBM4 memory and prepared it for high-volume manufacturing of memory stacks, the company said on Friday. HBM4 stacks from SK hynix go beyond specifications set ...

An ultrathin ferroelectric capacitor, designed by researchers from Japan, demonstrates strong electric polarization despite ...

Modern artificial intelligence systems operate with a fundamental paradox: they demonstrate remarkable reasoning capabilities while simultaneously suffering from systematic amnesia. Large language ...

JEDEC is still finalizing the HBM4 memory specifications, with Rambus teasing its next-gen HBM4 memory controller that will be prepared for next-gen AI and data center markets, continuing to expand ...

The chip industry is progressing rapidly toward 3D-ICs, but a simpler step has been shown to provide gains equivalent to a whole node advancement — extracting distributed memories and placing them on ...