The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory ...

Data is an integral part of our lives. Contrary to the past, where files had to be removed periodically to free up storage space, we now assume that our data will never be deleted. Why risk deleting ...

JEDEC is still finalizing the HBM4 memory specifications, with Rambus teasing its next-gen HBM4 memory controller that will be prepared for next-gen AI and data center markets, continuing to expand ...

Samsung's new codename Shinebolt HBM3e memory features 12-Hi 36GB HBM3e stacks with 12 x 24Gb memory devices placed on a logic die featuring a 1024-bit memory interface. Samsung's new 36GB HBM3e ...

Samsung plans to adopt hybrid bonding technology for its HBM4 to reduce thermals and enable an ultra-wide memory interface, the company revealed at the AI Semiconductor Forum held in Seoul, South ...

High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...