For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

Undergraduate students from packaging science, graphic design and industrial design at Rochester Institute of Technology worked over the semester to improve packaging and branding identity for ...

Packaging science goes far beyond mere protection and containment. It's a bridge between products and consumers, serving as a powerful tool for marketing, sustainability, and innovation. This is where ...