TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...
Semiconductor industry analysts project a bright future for TSMC's advanced packaging systems, driven by significant demand from the Middle East for AI-centric CoWoS chips and Apple's strategic ...
TL;DR: Apple is collaborating with TSMC to adopt advanced WMCM and SoIC packaging technologies for its next-generation A20 and server chips in 2026. These innovations enable ultra-dense chip stacking, ...
Apple’s semiconductor roadmap is poised for a major breakthrough in 2026 with the introduction of the A20 Pro chip.
TSMC is pushing its advanced packaging roadmap beyond its CoWoS platform and the wafer-level multi-chip module (WMCM) — an enhanced InFO-PoP due in 2026 — with a new integration called ...
SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...
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First India-made chip module sent to US firm AOS
India’s first commercially packaged multi-chip module (MCM) was rolled out of Kaynes Semicon’s outsourced semiconductor assembly and test (OSAT) facility in Sanand in the wee hours of Wednesday and ...
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