Qorvo, Inc. has launched three new highly integrated RF multi-chip modules (MCMs) designed for advanced radar applications. Leveraging Qorvo’s advanced packaging and process technology, the QPF5001, ...

NXP Semiconductors has claimed the industry’s first top-side cooling solution for RF power, which reduces the thickness and weight of 5G radios by more than 20 percent. The new family of top-side ...

RF front ends are advancing through the integration of high-frequency passive networks with increasingly efficient active devices engineered for ultra-wide bandwidths and constrained power envelopes.

The QPF5001 X-band FEM incorporates a power amplifier, low-noise amplifier (LNA), and limiter. Half the size of a discrete component implementation, the MCM targets the 8- to 12-GHz X-Band. The ...

Mercury Systems MRCY has announced the introduction of a Direct Radio Frequency (RF) system-on-module (SOM), DRF2580 SOM. This SOM uses Intel’s INTC Agilex FPGAs to detect and reduce size, weight, ...

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Dec. 02, 2020 9:35 AM ETNXP Semiconductors N.V. (NXPI) Stock NXPIBy: SA News Team ...

In a significant leap for India’s semiconductor ambitions, the country’s first commercially packaged multi-chip module (MCM) rolled out early Wednesday from Kaynes Semicon’s outsourced semiconductor ...