SINGAPORE — Assembly and test company ST Assembly Test Services Ltd. has developed packaging for integrated circuits and additional passive components, which it calls the Chip Scale Module Package ...

Nvidia has been working on a prototype multi-die AI accelerator chip called RC 18. The 36-module strong chip, developed by Nvidia Research, is currently being evaluated in the labs, and its highly ...

Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...

The semiconductor industry is undertaking a major strategy shift towards multi-die systems. The shift is fueled by several converging trends: Size of monolithic SoCs is becoming too big for ...