LAS VEGAS, NV, UNITED STATES, January 20, 2026 /EINPresswire.com/ — CIT (CEO Seung Jeong) announced its participation in CES 2026, the world’s largest IT and consumer electronics exhibition, held in ...

TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...

These days when we talk about what's next for chip design, we focus on things like cramming in more cores, increasing clock speeds, shrinking transistors and 3D stacking. We rarely think about the ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

Intel announced one of the industry's first glass substrates for next-generation advanced packaging, planned for the latter part of this decade. This breakthrough achievement will enable the continued ...

Recently, that number has risen to five, and while it adds far more flexibility for structuring electronic equipment, it also ...

SANTA CLARA, Calif. and TOKYO, Dec. 12, 2023 (GLOBE NEWSWIRE) -- Applied Materials, Inc. and Ushio, Inc. today announced a strategic partnership to accelerate the industry’s roadmap for heterogeneous ...

The semiconductor is a highly integrated device that cannot be connected directly to the main board in the way that condensers or resistors can. Therefore, a packaging substrate (or intermediary layer ...

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...

Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...