In this work, we propose a new signal routing method for solving routing problems that occur in the design process of semiconductor package substrates. Our work uses a topological transformation of ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

Recently, that number has risen to five, and while it adds far more flexibility for structuring electronic equipment, it also ...

SUNNYVALE, Calif.--(BUSINESS WIRE)-- Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced the launch of its Integrated ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

As high-speed data access, transmission, and storage move from high-end computing and long-haul SONET (synchronous-optical-network) applications into portable computing and Ethernet LANs (local-area ...

Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...

The PSMA (Power Sources Manufacturers Association) Packaging Committee announced that it has published a report titled "Current Developments in 3D Packaging With Focus on Embedded Substrate ...

These days when we talk about what's next for chip design, we focus on things like cramming in more cores, increasing clock speeds, shrinking transistors and 3D stacking. We rarely think about the ...

Antenna packaging methodologies have evolved significantly to counter the escalating signal attenuation in high-frequency communications like 5G mmWave and anticipated 6G networks. Benchmark of ...

Path to Systems - No 3: This article provides insights into how the design and manufacturing process of system-in-package technology will extend Moore’s vision, creating Moore’s law 2.0.