The limits of monolithic integration, together with advances in chip interconnect and packaging technologies, have spurred the growth of heterogeneous advanced packaging where multiple dies are ...

Before package testing can begin, there are several items that need to be considered, including—but not limited to—cost, sample size, test method, and acceptance criteria. Arriving at the perfect ...

Merger will allow TCP and DDL customers to achieve a new, consolidated level of packaging success. Edison, NJ (PRWEB) October 3, 2007 -- TCP Reliable, a thermal packaging solutions manufacturer and ...

AGOURA HILLS, Calif. — Making a more aggressive push into the wafer-probe space, Teradyne Inc. has unveiled a memory test system with an architecture specifically designed for high-parallel test and ...

The emphasis on heterogeneity is increasing the burden on OSATs and foundries to make sure everything works as expected inside a package. Putting a variety of chips or hardened IP blocks into a ...