Neetin Ghaisas explores the equipment modularization concept and machinery modules, their structure and the associated benefits. Many small and large rotating, and reciprocating machinery packages, ...

The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...

The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC ...

To ease the layout of industrial Linux computer PCBs, at Embedded World in Nuremberg Microchip announced a complete processor, memory and comms sub-system in a 40 x 38mm module. The module is single ...

Scientists in China placed a 0.5 mm thick aluminum foil between the solar cell and the EVA, and between the EVA and the glass layer. The two experimental modules were compared to a reference module ...