The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...
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A tiny power module might ease the world’s energy crunch

Global electricity demand is rising faster than new large power plants can be built, and the cost of that imbalance is showing up in household bills and grid instability. Instead of relying only on ...
Enhancing thermal management in electric vehicle propulsion systems: A focus on optimizing irregular pinfin structures and collaborative design with dc bus capacitors and motors The paper investigates ...
Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).