Last week, I posted a brief summary of sales tax issues related to software and computer programs. However, as the characterization and taxability of “data processing” is such a complex and hotly ...
We're explaining what data centers are and how they help you connect to your favorite digital experiences, from sharing a photo on Instagram to chatting with AI assistants.
Today’s enterprises store valuable business intelligence in documents, including Word files, PDFs, spreadsheets, and physical records. By extracting valuable insights from documents, enterprise ...
On March 28, 2025, the Texas Comptroller of Public Account (the “Comptroller”) finalized amendments to Rule 3.330, Data Processing Services, for purposes of the Texas sales and use tax. The amended ...
Low-code has elevated, pun intended. The rise of low-code application development technologies designed to perform software architecture and workflow process automation and acceleration has been ...
Celonis SE is stepping up its efforts to help organizations reshape their business operations with agentic artificial intelligence, announcing today at its annual user conference Celosphere 2025 new ...
Get the latest federal technology news delivered to your inbox. Through three years, 16 federal agencies, more than 1,300 datasets and a cascade of privacy laws and interagency agreements underpinned ...
Did you know that 90% of the world’s data has been created in the last two years alone? With such an overwhelming influx of information, businesses are constantly seeking efficient ways to manage and ...
The ability to gather process data on the production line is reshaping biopharmaceutical manufacturing, allowing drug companies to make more consistent, higher-quality medicines more efficiently and ...
Apache Arrow defines an in-memory columnar data format that accelerates processing on modern CPU and GPU hardware, and enables lightning-fast data access between systems. Working with big data can be ...
Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...