The collaboration aims to enhance power electronics. Credit: Fahroni/Shutterstock. Automotive technology company Valeo has partnered with ROHM Semiconductor to jointly develop the next generation of ...
Santa Clara, CA and Kyoto, Japan, April 24, 2025 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced the development of new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for ...
Santa Clara, CA and Kyoto, Japan, Sept. 16, 2025 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced the development of the DOT-247, a new 2-in-1 SiC molded module (SCZ40xxDTx, SCZ40xxKTx) designed ...
KYOTO, Japan, April 24, 2025 /PRNewswire/ -- ROHM Co., Ltd. has developed new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package for power-factor-correction (PFC) circuits and LLC-resonant ...
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