Over the past five years, stacked die packaging technologies have gradually gained market acceptance for use in cell phone and handheld applications — where increased functionality, reduced form ...
TAIPEI, Taiwan--(BUSINESS WIRE)--TrendForce reports that the focus on HBM products in the DRAM industry is increasingly turning attention toward advanced packaging technologies like hybrid bonding.
SAN MATEO, Calif. — Stacked-die packaging — in which IC dice are literally stacked one on top of the other, electrically connected and encapsulated — has taken root in the cell-phone handset market as ...
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