Tessera Technologies Inc. has unveiled a tiny stacking package that enables users to mix and match independently tested silicon devices and stack them within a single-chip footprint. The company's ...
Stacking two or more packages that have been fully tested, completed burn-in and been verified as known good devices is possible using Amkor Technology Inc.'s etCSP package configuration, the company ...
An advanced packaging technology has been developed that allows the mechanical stacking of chip-scale memory devices using a fine-pitch ball grid array (FBGA) interface. Significantly reducing ...
Three silicon-validated Reference Flows within the Open Innovation Platform that enable 16FinFET SoC designs and 3D chip stacking packages have been released by the Taiwan Semiconductor Manufacturing ...
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