The consortium is a national initiative and supported by the Singapore Economic Development Board (EDB) and A*STAR. IME is teaming up with A*STAR’s Institute of High Performance Computing (IHPC) and ...
SINGAPORE--A new consortium has been established to advance the country's next-generation 300mm wafer manufacturing capabilities, by focusing on a technology for three-dimensional integrated circuits ...
Via reveal, or post-TSV processing occurs after the through silicon vias (TSVs) are formed. The wafer is then temporarily bonded, face down, onto a carrier and ground typically to within 5-10 ...
Two years ago, at the annual IMAPS conference on 2.5D and 3D chip packaging, the presentations were dominated by talk of fan-out wafer-level packaging. There was almost no talk of through-silicon vias ...
Historically, the speed and complexity of electronic circuits required for manufacturing has out-matched the interconnects used to join circuits together. A first approximation of interconnect ...
The AI trend has fueled the high-bandwidth memory (HBM) business opportunities, which in turn has brought attention to related equipment supplier Hanmi Semiconductor. Recently, to expand its ...
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