A new technical paper titled “DECOR: Deep Embedding Clustering with Orientation Robustness” was published by researchers at Oregon State University and Micron Technology. “In semiconductor ...
BEIJING, Aug. 31, 2023 /PRNewswire/ -- WiMi Hologram Cloud Inc. (WIMI) ("WiMi" or the "Company"), a leading global Hologram Augmented Reality ("AR") Technology provider, today announced that an ...
Semiconductor process engineers have always understood the need to inspect silicon wafers to identify defects and eliminate them at their source. To simplify the process, semiconductor equipment ...
Wafer breakage is the most serious impact of killer crystalline defects. About 0.1 to 0.2% of silicon wafers break. The higher the number of wafer breakages, the slower the time to market. Given the ...
Microelectronic device manufacturers can use the IRIS wafer-inspectionsystem from SemiProbe to detect flaws in the wafer circuit pattern, aswell as contamination or process damage. Depending on the ...
As IC devices get smaller and smaller, the challenge of detecting faults becomes bigger and bigger. Tamar Technology designs and manufactures application-specific automated visual inspection and metro ...
Semiconductor circuits (patterns) printed on semiconductor wafers (substrates) are shrinking, while such substrates are becoming larger in physical size. Over the years, the inspection of patterned ...
What is the Market Size of Wafer Defect Inspection System? BANGALORE, India, Dec. 16, 2025 /PRNewswire/ -- In 2024, the global market size of Wafer Defect Inspection System was estimated to be worth ...
As semiconductor manufacturers aim to produce devices at the 5-nanometer node, the ability to find tiny defects created inadvertently during the fabrication process becomes harder. In addition, there ...
In this interview, Dr. Chady Stephan, PhD, the Applied Markets Leader at PerkinElmer, talks to AZoM about the current trends shaping semiconductor wafer manufacturing. A semiconductor is a material ...
Scan diagnostics play an important role in improving yield. As technologies move below 130 nm, the IC industry has seen a significant change in the type of defects encountered. Feature-related defects ...
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