TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...
SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...
The A20 chip widely expected to debut in the iPhone 18 Pro and folding iPhone will take advantage of a new packaging technique, on TSMC's 2nm chip fabrication technology. Rumors about the iPhone 18 ...
Industry experts are closely tracking the development of the Apple 2nm A20 Pro chipset, expected to launch in late 2026.
Apple is rumored to release the iPhone 18 Pro Max in September 2026, introducing several exciting upgrades that could ...
TL;DR: NVIDIA is exploring CoWoP PCB packaging for its next-gen Rubin R150 AI GPUs, offering improved signal and power integrity, enhanced thermals, and reduced costs by eliminating the package lid.
CEO Daniel Baker reported a 4% sequential increase in revenue for the quarter, highlighting strong increases in distributor and nondefense sales, despite an expected decrease in defense sales. Baker ...
The majority of the credit goes to the DRAM, and then comes the chip costs. The year 2026 will see a breakthrough into the 2nm era. Apple has reportedly booked more than half of TSMC’s 2nm capacity.
Apple is reportedly on the cusp of leading the way in mobile chipset manufacturing and processing power, with rumors suggesting that the future iPhone 18 Pro models will be powered by a groundbreaking ...
In a research note today, Apple supply chain analyst Ming-Chi Kuo suggested that MacBook Pro models with M5 chips might not launch until 2026. Kuo discussed how the A20 chips in iPhone 18 models will ...
Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...