The growing amount of electronics within modern vehicles has made the inspection process for wire bonds increasingly challenging, as active devices shrink and bonds are arranged in complex ways.

Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...

Adding more layers in packages is making it difficult, and sometimes impossible, to inspect wire bonds that are deep within the different layers. Wire bonds may seem like old technology, but it ...

DUBLIN--(BUSINESS WIRE)--The "Inspection Machine - Global Market Outlook (2017-2026)" report has been added to ResearchAndMarkets.com's offering. The Global Inspection Machine market accounted for ...

New York, Feb. 03, 2023 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Inspection Machines Market by Product, Type, Packaging Type, End ...

CHICAGO, Jan. 8, 2021 /PRNewswire/ -- According to the new market research report "Inspection Machines Market by Product (Vision Inspection, Checkweigher, Metal Detector, Software), Type (Manual, ...