LAS VEGAS, NV, UNITED STATES, January 20, 2026 / EINPresswire.com / — CIT (CEO Seung Jeong) announced its participation in ...
TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...
These days when we talk about what's next for chip design, we focus on things like cramming in more cores, increasing clock speeds, shrinking transistors and 3D stacking. We rarely think about the ...
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Intel details new advanced packaging breakthroughs — EMIB-T paves the way for HBM4 and increased UCIe bandwidth
Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...
SmartSolve has introduced its PureNil 0 packaging substrate, said to be a 100% bio-based and flushable material designed to ...
Intel announced one of the industry's first glass substrates for next-generation advanced packaging, planned for the latter part of this decade. This breakthrough achievement will enable the continued ...
TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...
SANTA CLARA, Calif. and TOKYO, Dec. 12, 2023 (GLOBE NEWSWIRE) -- Applied Materials, Inc. and Ushio, Inc. today announced a strategic partnership to accelerate the industry’s roadmap for heterogeneous ...
Recently, that number has risen to five, and while it adds far more flexibility for structuring electronic equipment, it also ...
For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...
The semiconductor is a highly integrated device that cannot be connected directly to the main board in the way that condensers or resistors can. Therefore, a packaging substrate (or intermediary layer ...
Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...
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