New Imaging Technologies (NIT), a leading French manufacturer of InGaAs SWIR sensors and cameras, announces the launch of the LiSaSWIR 2048 v2, a high-performance upgrade of its line-scan SWIR camera ...

Dutch chip gear maker ASML has lifted the kimono its Twinscan XT:260, a new lithography scanner built for the brave new world of 3D chip packaging. The outfit claims that it is the first machine of ...

[Matt and Kaitlin Hova] have created The Hovalin, an open source 3D-printed violin. Yes, there have been 3D-printed instruments before, but [The Hovas] have created something revolutionary – a 3D ...

Abstract: A defective through-silicon via (TSV) may cause a small delay fault that is difficult to detect using conventional logic testing methods. Testing TSVs used for chip-to-chip interconnection ...

A groundbreaking, high-resolution 3D reconstruction of the Titanic wreck has unveiled new clues about the ship’s ill-fated descent into the icy waters of the North Atlantic. Developed by deep-sea ...

Big Tech lobbies EU, Oracle shifts, OpenAI evolves | Ep. 13 In today’s Tech Briefing: Big Tech outspends entire industries lobbying the European Union, with Meta leading a €151 million push to ...

School of Materials Science and Engineering, Chongqing Jiaotong University, Chongqing 400074, P. R. China ...

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