Researchers built a chip-sized processor and 3D-printed copper antenna arrays that could enable flexible, wearable wireless ...

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Blind and low-vision programmers have long been locked out of three-dimensional modeling software, which depends on sighted users dragging, rotating and inspecting shapes on screen. Now, a ...

Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...

Abstract: Real-time and 3-D monitoring of cavitation activity is critical for safe, effective, and controlled treatments in cavitation-based focused ultrasound (FUS) therapies. This 3-D monitoring ...