Congatec conga-TCRP1 is a COM Express 3.1 Type 6 Compact module powered by the newly announced AMD Ryzen AI Embedded P100 ...

COM Express Compact module based on the latest AMD Ryzen™ AI Embedded P100 processor series. SAN DIEGO, CA, UNITED STATES, January 20, 2026 /EINPresswire.com/ ...

CES 2026 showcases the latest AI-powered devices and systems, from vision chips for automotive to sensing solutions for AI ...

Virtualization helps overcome the limitations of traditional test systems. By consolidating multiple PCs into a single ...

ASUS has started rolling out two of its AM5 halo motherboards based on AMD’s X870E chipset, first shown at CES 2026: the ROG ...

Apple's base iPhone 18 is controversially rumored to debut in early 2027, but we've already seen plenty of claims about the ...

The iPhone 18 Pro lineup is expected to debut Apple’s A20 Pro chip, marking the company’s first processor built on a cutting-edge 2nm process. According to reports, the chip will also use WMCM ...

In this Motorola Signature review, we take a look at the smartphone's real world performance, camera capabilities, battery ...

A more focused flagship that embraces small yet meaningful improvements ...

Is the Poco M8 just a rebranded Redmi Note 15? Read our review covering design, display, camera, performance, battery, and HyperOS support.

News from the week beginning 19th January 2026 includes @1111Systems, @CybageSoftware, @Deltek, @Infor, @ThomsonReuters, @VertiGIS and @Zoho ...

They accelerate embedded computing applications with up to 59 TOPS of combined AI inference performance, with up to 50 TOPS provided by the XDNA2 NPU, and the remaining performance delivered by up to ...