Dutch chip gear maker ASML has lifted the kimono its Twinscan XT:260, a new lithography scanner built for the brave new world of 3D chip packaging. The outfit claims that it is the first machine of ...

New Imaging Technologies (NIT), a leading French manufacturer of InGaAs SWIR sensors and cameras, announces the launch of the LiSaSWIR 2048 v2, a high-performance upgrade of its line-scan SWIR camera ...

Abstract: A defective through-silicon via (TSV) may cause a small delay fault that is difficult to detect using conventional logic testing methods. Testing TSVs used for chip-to-chip interconnection ...

We introduce InterAct, a comprehensive large-scale 3D human-object interaction (HOI) dataset, originally comprising 21.81 hours of HOI data consolidated from diverse sources, the dataset is ...

You can create a release to package software, along with release notes and links to binary files, for other people to use. Learn more about releases in our docs.

School of Materials Science and Engineering, Chongqing Jiaotong University, Chongqing 400074, P. R. China ...