The total investment in the OSAT project amounts to Rs 3,307 crore, with contributions from the Centre (Rs 1,653.5 crore), the Gujarat government (Rs 661.4 crore), and Kaynes (Rs 992.1 crore) India's ...

Kaynes Tech Futures is today’s stock pick with strong growth potential. The company’s subsidiary has started commercial production for module chips, indicating future expansion and increased revenue ...

In addition to a previous contract manufacturing deal with Tesla to produce the next-generation AI6 chip, Samsung Electronics' foundry business has won orders for the electric vehicle maker's AI5 chip ...

In a significant leap for India’s semiconductor ambitions, the country’s first commercially packaged multi-chip module (MCM) rolled out early Wednesday from Kaynes Semicon’s outsourced semiconductor ...

Broadband gear maker GX Group on Friday said it will set up a photonic module and chip arm in India with an initial investment of Rs 500 crore. The subsidiary, GX Quantum Photonics Pvt Ltd, will be ...

Kaynes Semicon’s outsourced semiconductor assembly and test (OSAT) facility in Sanand, Gujarat, rolled out India’s first commercially packaged multi-chip module (MCM), which was dispatched early ...

Proteomics is the systematic study of the many and diverse properties of proteins in a parallel manner with the aim of providing detailed descriptions of the structure, function and control of ...

Broadband gear maker GX Group on Friday said it will set up a photonic module and chip arm in India with an initial investment of Rs 500 crore. The new subsidiary, headquartered in Manesar, Gurgaon, ...

Advanced Ceramic X Company Profile Advanced Ceramic X Corporation designs, manufactures, and sells RF front-end devices and modules for wireless communication applications in Taiwan, China, the United ...

Nvidia leads AI tech with $5 trillion market cap, driven by high demand for its GPUs in AI applications. AI market growth is projected to increase from $235 billion in 2024 to over $631 billion by ...

Abstract: To address the escalating risks of parasitic oscillations and high switching losses in multi-chip paralleled SiC MOSFET modules with high device counts, this article proposes a distributed ...