PICMG, the consortium for developing open embedded computing specifications, has anounced the release of the COM-HPC Platform Management Interface (PMI) specification. This specification provides a ...

FREMONT, Calif.--(BUSINESS WIRE)--OIF continues to lead industry discussion on interoperability efforts through an upcoming webinar, “Common Management Interface Specification (CMIS) - Demystified,” ...

The Module-Driver Interface Special Interest Group (MD-SIG) has released its specification for a universal electrical interface between LED lighting modules and their power supplies. The standard has ...

Toshiba Semiconductor Company decided to widely adopt OCP as the host interface for in-house IP cores. OCP, which is standardized by OCP-IP, is the specification standard host interface for these ...

FREMONT, Calif.--(BUSINESS WIRE)--OIF, where the optical networking industry’s interoperability work gets done, today announced the completion of the Coherent Common Management Interface Specification ...

SGET, a technical consortium hosting and developing specifications for embedded computer technology, has announced release 1.0 of the new OSM Computer-on-Module standard. OSM (Open Standard Module) ...

This application note explains the use of MSSP module to interface SPI™ serial EEPROMs with PIC18 devices. This document include the firmware description, initialization, write enable, read status ...