10 things I learned from burning myself out with AI coding agents

As independent AI researcher Simon Willison wrote in a post distinguishing serious AI-assisted development from casual “ vibe ...
IEEE

SiC Power Module Packaging Using Printed Electronics Materials and Processes

Abstract: Advanced packaging solutions for wide bandgap power devices, such as silicon carbide (SiC) MOSFETs, can help realize their full potential. Additively printed electronics present a promising ...
GitHub

Cody for Visual Studio

Sourcegraph’s AI code assistant goes beyond individual dev productivity, helping you achieve consistency and quality at scale with AI. Sourcegraph accelerates the entire workflow for developers by ...
IEEE

EEG-based Emotion Recognition using Graph Attention Network with Dual-Branch Attention Module

Abstract: EEG reveals human brain activities for emotion and becomes an important aspect of affective computing. In this study, we developed a novel approach, namely DAM-GAT, which incorporated a dual ...