IEEE

Electro-Thermal-Mechanical Multiphysics Co-Simulation of Chiplet Architecture based on the FDTD method

Abstract: In this paper, we introduce a novel electro-thermo-mechanical simulation framework utilizing the unified FDTD method for efficient and accurate analysis of electrical, thermal, stress, and ...
Morningstar

Alpha and Omega Semiconductor Announces Commencement of Production of Intelligent Power Module (IPM5) Products at Kaynes Semicon Inaugural Opening in Sanand, Gujarat

Alpha and Omega Semiconductor Announces Commencement of Production of Intelligent Power Module (IPM5) Products at Kaynes Semicon Inaugural Opening in Sanand, Gujarat Alpha and Omega Semiconductor ...
EurekAlert!

New multiphysics model helps reveal how battery swelling force builds during charging

Researchers have developed a detailed three-dimensional electro-thermo-mechanical model to identify and quantify the swelling force generated by lithium-ion batteries during charging, offering a new ...
Compoundsemiconductor.net

Researchers demonstrate megawatt-class Ga₂0₃ module

Module can pulse switch continuously at 1000V and 1000A, enhancing capacity of UWBG power electronics by over two orders of magnitude An engineering research team from the University of Hong Kong led ...
CNBC

Chinese chip firms hit record high revenue driven by the AI boom and U.S. curbs

Chinese chip companies from SMIC to Hua Hong have reported record high revenue for 2025 with analysts projecting further growth. This has been driven by huge demand for semiconductors related to AI.
IEEE

An Accuracy-Preserving Multiphysics FETI-DP Framework for Electromagneto-Thermo-Mechanical Analysis

Abstract: This article presents an accuracy-preserving unified multiphysics domain decomposition framework for electromagneto-thermo-mechanical analysis, which is based on the dual–primal ...