ADLINK Technology has launched what it says is the first COM Express module to use Intel Core Ultra Series 3 processors.

The Dragon Q6A SBC packs Qualcomm QCS6490 with 12 TOPS AI and Wi-Fi 6, giving faster edge apps and smoother 4K playback for ...

SK hynix unveiled its next generation of artificial intelligence memory chips, including a 16-layer HBM4, at CES 2026 in Las Vegas on Tuesday. The chipmaker opened a customer-only exhibition booth to ...

Today at CES, Intel said laptop preorders will begin tomorrow, January 6th, with the first laptops shipping on January 27th — ...

The chiplet-based approach allows Intel to mix-and-match these tiles to offer three distinct iterations of Panther Lake: the ...

We are all familiar enough by now with the succession of boards that have come from Raspberry Pi in Cambridge over the years, ...

CES attendees are invited to experience Patriot Memory's latest memory and storage technologies January 6–9, 2026, in Las ...

But could the most powerful consumer GPU in the world really reach $5,000 in just a year’s time? Leaked industry reports show ...

Modern artificial intelligence systems operate with a fundamental paradox: they demonstrate remarkable reasoning capabilities while simultaneously suffering from systematic amnesia. Large language ...

A practical guide to the four strategies of agentic adaptation, from "plug-and-play" components to full model retraining.

The release of EXPO 1.2 is perhaps not as interesting as what it represents for the future of AMD's processors.

These mini PCs might launch in 2026, bringing bold designs, ARM and x86 power, AI-ready hardware, and desktop-class performance in compact form factors.