The technical failure coincided with TikTok’s ownership transition, leading users to question whether videos criticizing ICE ...

1 Guangzhou Metro Design and Research Institute Co Ltd, Guangzhou, China 2 School of Earth Sciences and Engineering, Sun Yat-sen University, Zhuhai Campus, Zhuhai, China The final, formatted version ...

Grail is on a mission to have its cancer blood test become a core part of U.S. screening for a range of tumors. Now, it’s detailing its latest data as it heads to the FDA. Back in June, Grail revealed ...

Introduction: In unsupervised learning, data clustering is essential. However, many current algorithms have issues like early convergence, inadequate local search capabilities, and trouble processing ...

During the penetration process of hypersonic glide vehicles (HGV), the maneuvering forms are varied, which brings some challenges for tracking them, such as difficulty in the stable matching of single ...

Welcome to the Data Structures and Algorithms Repository! My aim for this project is to serve as a comprehensive collection of problems and solutions implemented in Python, aimed at mastering ...

If you rotate an image of a molecular structure, a human can tell the rotated image is still the same molecule, but a machine-learning model might think it is a new data point. In computer science ...

Abstract: A general problem in multi-node systems is data synchronization, where the most used method uses synchronous data updating. All changes made by the user are immediately reflected in the data ...

Test automation and DevOps play a major role in today's quality assurance landscape. As we know, software development is evolving at a rapid pace. This requires finding robust ways to invest in ...

Abstract: This innovative practice full paper describes how to integrate generative Artificial Intelligence (AI) with Data Structures and Algorithm Analysis (CS2) homework at Oklahoma State University ...

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...