As integration and switching rates increase rapidly, the concentration of heat losses is similarly changing. The continuous trend to shrink die size steadily increases the amount of heat to be ...
Norton, Mass. — CPS Technologies Corp. has introduced base plates, based on its aluminum silicon carbide (AlSiC) metal matrix composite material, for insulated gate bipolar transistor (IGBT) modules ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results