is a technology based contract assembly facility specializing in first level microelectronics packaging. The company has Class 10,000 ESD protected cleanrooms for die attach, wire bonding, and …

first level inc. is a leader in the contract microelectronic packaging industry. Since 2000 we have been producing and assembling quality products for industries including: medical electronics, …

first level inc. - 3109 Espresso Way, York, PA 17406 - E-mail: [email protected] - Tel: (717) 266-2450 Fax: (717) 266-7410 - Visit Us - Located just minutes off Interstate 83 in York, PA

fli has extensive experience in many aspects of microelectronic packaging. Many of our customers come to us for our exceptional quality and attention to detail. Choose any of the headings in the image to …

first level inc. provides services related to the first level of electronic assemblies, i.e. at the microchip level. Our core competency is in direct chip attach (DCA) and chip-on-board (COB).

first level is committed to providing competitive total compensation (wages and benefits) for our employees. We understand the value and importance of rewarding people for their talent, passion …

The stud bump process is extremely cost effective and can be carried out on individual die, either at the wafer level or after singulation. The unique manufacturing methodology can even accommodate full …

We are a technology driven microelectronics packaging facility that applies many commercial packaging techniques to the microelectronics packaging industry. Read more J-STD-001 Certified Staff IPC-A …

Substrate, Lead Frame, and Package Design. Our Engineers' have the experience to deliver success

Dam and fill is a two-part process consisting of a dam being dispensed first, followed by a fill material. As an alternative to dam and fill, a glob top process can be done.